【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Part22:Bondstrength
【原文标准名称】:半导体器件.机械和气候试验方法.第22部分:粘接强度
【标准号】:IEC60749-22-2002
【标准状态】:现行
【国别】:国际
【发布日期】:2002-09
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC47
【标准类型】:()
【标准水平】:()
【中文主题词】:半导体;粘结强度;电子设备及元件;电子工程;半导体器件;环境试验;环境试验;集成电路;组件;电气工程;试验;气候试验;机械试验
【英文主题词】:Bondstrength;Climatictests;Components;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Environmentaltests;Integratedcircuits;Mechanicaltesting;Semiconductordevices;Semiconductors;Testing
【摘要】:Applicabletosemiconductordevices(discretedevicesandintegratedcircuits),thistestmeasuresbondstrengthordeterminecompliancewithspecifiedbondstrengthrequirements
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:41P.;A4
【正文语种】:英语


MIL-STD-453C, MILITARY STANDARD: INSPECTION, RADIOGRAPHIC (27 DEC 1984) [S/S BY ASTM-E1742] [SUPERSEDES MIL-STD-00453B & MIL-R-11470A] [S/S BY ASTM-E1742]., The purpose of this military standard is to prescribe the radiographic inspection requirements for metallic and nonmetallic materials.